DH-A1L 技术参数 总功率 Total Power 4900W 上部加热功率 Top heater 800W 下部加热功率 Bottom heater 第二温区1200W，第三温区2700W（加大型发热面积以适应各类P板）数显恒温铬铁80W 电源 power AC220V±10％ 50/60Hz 外形尺寸 Dimensions L650×W700×H650 mm 定位方式 Positioning V字型卡槽,PCB支架可X方向调整并外配*夹具 温度控制方式 Temperature co*ol K型热电偶（K Sensor） 闭环控制（Closed loop） 温度控制精度 Temp accuracy ±2℃ PCB尺寸 PCB size Max 500×450 mm Min 22×22 mm 适用芯片 BGA chip 2X2-80X80mm 适用**小芯片间距 Minimum chip spacing 0.15mm 外置测温端口 External Temperature Sensor 1个，可扩展（optional） 机器重量 Net weight 48kg Feature: 1.Embedded Industrial PC, high definition touch screen interface, PLC co*ol, and instant profile analysis function. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters if necessary. 2.It uses precise K-type close circuit co*ol and automatic temperature adjustment system, with PLC and temperature module to enable precision temperature co*ol of ±2 degC. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile. 3.V-groove PCB support for rapid, convenience and accurate *itioning that fits for all kinds of PCB board. 4.Flexible and convenient removable fixture on the PCB board which protectsand prevent damage to PCB. It can also adapt to rework various BGA packages. 5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement; 6.Three temperature areas can independently heat and are multiple co*ollable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface. 7.There are 6-8 levels of variable and constant temperature co*ols. Massive storage of temperature curves which are Instant accessible according to different BGA. Curve analysis, setting and adjustment are all accessible via touch screen. Three heating areas adopts independent PID calculation to co*ol heating process to enable more accurate and precise temperature co*ol. 8.It uses high powered blower to enable fast cooling of PCB board and prevent it from deformation. There are also internal vacuum pump and external vacuum pen to assist with fetching the BGA chip. 9.Laser *itioning, fast and effectively fix PCB 10.USB output interface. 11.Equipped with constant temperature digital display soldering iron 12.Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. Cooling system will start after vertical wind stopped heating. When the temperature drops to room temperature, the cooling process will stop, so that the machine will not age after heated up. 13.CE certification, with emergency switch and automatic power-off protection device when emergency happens. DH-A1L主要性能与特点： ● 嵌入式工控电脑，7寸高清触摸屏人机界面， ARM32位微处理器，上部和下部风扇转速从0～*任意可调； 具有瞬间曲线分析功能. 实时显示设定和实测温度曲线，并可对曲线进行分析纠正； ● 高精度K型热电偶闭环控制和温度自动补偿系统，整机控制电路，功率输出与控制系统采用光电隔离技术；采用 PID自整定系统实现对温度的精准控制，保持温度偏差在±2℃.同时外置测温接口实现对温度的精密检测，并实现 对实测温度曲线的*分析和校对； ● PCB板定位采用V字型槽，定位快捷、方便、准确，满足不同PCB板排版方式及不同大小PCB板的定位； ● 灵活方便的可移动式*夹具对PCB板起到保护作用，防止PCB边缘器件损伤及PCB变形，并能适应各种BGA 封装尺寸的返修； ● 配备多种规格合金风嘴，该风嘴可360度任意旋转定位，易于安装和更换； ● 上下共三个温区独立加热，三个温区可同时进行多组多段温度控制，保证不同温区同步达到*焊接效果。
深圳市鼎华科技有限公司
